[Chun-Chieh Wong, Cheng-Yu Wang, Ming-Hsiu Wu] TW Taipei City A slim fan includes a casing, a fan module and a ring cover. The casing includes an upper casing which has an opening, and a lower casing. The fan module includes a plurality of fans annularly disposed in the opening, and each of the fans has a first side and a second side opposite to each other. The ring cover is connected to the first side of the fans and exposed out of the opening. The height of the fans is equal to that between the upper casing and the lower casing.

[Chun-Chieh Wong, Cheng-Yu Wang, Ing-Jer Chiou] TW Taipei City A cooling fin, applied in a heat dissipation module, includes a fin body, a penetration portion, and at least one bending portion. The penetration portion is formed on the fin body and includes a slot, a first bending wall, and a second bending wall. The first bending wall and the second bending wall are formed at the opposite sides of the slot. The bending portion is formed on the fin body and adjacent to one end of the slot.

[Chun-Chieh Wong, Chen-Yu Wang] TW Taipei A ventilator includes a first casing, a second casing, a fan blade and a flow guider. The second casing is connected to the first casing and forms a flow channel between the first casing and the second casing. The fan blade is disposed between the first casing and the second casing. When the fan blade rotates, an air-flow compression zone and an air-flow decompression zone are formed in the flow channel. The flow guider is formed along a boundary line to the air-flow decompression zone, wherein the boundary line is adjacent to the air-flow compression zone and the air-flow decompression zone. With the ventilator, the air pressure of the ventilator is increased and noise can be controlled.

[Chun-Chieh Wong, Cheng-Yu Wang] TW Taipei A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.

[Chun-Chieh Lin, Wong-Cheng Shih] TW Hsin-Chu A method of forming a DRAM capacitor structure featuring increased surface area, has been developed. The method features a polysilicon top plate structure located overlying an array comprised of individual polysilicon storage node structures. Each polysilicon storage node structure is comprised with tall, vertical features, and additional surface area is obtained via removal of butted insulator layer from a first group of surfaces of the storage node structures. Insulator layer remains butted to a second group of storage node structure surfaces to prevent collapse of the tall, vertical features of the storage node structures during subsequent processing sequences.

[WONG CHUN-CHIEH, WANG CHENG-YU] TW A water cooling apparatus adapted to connect to an electronic device for heat dissipation is provided. The water cooling apparatus includes heat dissipating assembly, pump, quick connector, heat exchange assembly, circulation pipeline, and refrigeration module. The heat dissipating assembly has a coolant. The pump is disposed in the heat dissipating assembly. The circulation pipeline is connected to the heat dissipating assembly. The quick connector is connected to the circulation pipeline. The heat exchange assembly is disposed between the heat dissipating assembly and the quick connector, and communicates with the circulation pipeline. The coolant is driven by the pump to flow into the circulation pipeline, the heat exchange assembly, and the quick connector in sequence for entering the electronic device, and the coolant flows back into the heat dissipating assembly through the circulation pipeline.

[HUANG YA-HUI, WONG SIAO-WUN, CHUANG PING-HSIU, TSAI MING-CHEN, LIN CHUN-CHIEH, YANG YI-CHIEN, WU YU-RONG, TSAI YI-SHAN] TW

[Chun-Chieh Wong, Cheng-Yu Wang] TW Taipei A heat dissipating module disposed between a plurality of heating elements is provided. The heat dissipating module includes a plurality of heat conducting units, a set of heat dissipating fins, a plurality of fans, a plurality of sensing units and a control unit. The heat conducting units are connected to the set of the heat dissipating fins and the heating elements. A gap exists between the heat conducting units. The fans are disposed at the same side of the set of the heat dissipating fins. The sensing units are coupled to the heating elements, respectively, to detect the heat generated by the heating elements. The control unit is electrically connected to the fans and the sensing units. The heat generated by the heating elements is different from each other, and the control unit adjusts the speed of the fans according to the heat generated by the heating elements.

[WONG, Chun-Chieh, WANG, Cheng-Yu] No. 15, Lide Road Beitou District, Taipei City 112, TW A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium. ＜img id="iaf01" file="imgaf001.tif" wi="158" he="102" img-content="drawing" img-format="tif" /＞

[WONG CHUN-CHIEH, WANG CHENG-YU] TW A heat dissipating device includes a supporting portion, plural first fins and plural second fins. The first fins vertically disposed at the supporting portion side by side. The second fins obliquely disposed at the carry portion side by side. The first fins and the second fins are disposed corresponding to, staggered to and adjacent to each other. The invention can promote the heat dissipating efficacy of the fins significantly so as to increase the heat dissipating efficiency of the heat dissipating device.