[SCHEITER THOMAS, BIERNER JUSTIN, WITTE MARKUS, SASSE THORSTEN, MELZL MICHAEL, OPOLKA HEINZ, GOELLNER REINHARD, HAMMER KLAUS, BASSE PAUL-WERNER VON, SIPRAK DOMAGOJ, PETERS CHRISTIAN, GAYMANN ANDREAS, GROSSMANN RAINER, FISCHBACH REINHARD, ROSTECK THOMAS] DE The invention relates to an electronic component, comprising a dielectric layer (2) which is configured on a substrate (10), conductive surfaces (4; 14) which are configured on said dielectric layer and an electroconductive protective structure (6) which is arranged in a plane above the conductive surfaces (6) in such a way that the conductive surfaces (4; 14) are not (entirely) covered by the protective structure (6).

[Heinz Opolka, Paul-Werner Von Basse, Thomas Scheiter, Rainer Grossmann, Christian Peters, Reinhard Fischbach, Andreas Gaymann, Thomas Rosteck, Domagoj Siprak, Thorsten Sasse, Reinhard Gollner, Justin Bierner, Michael Melzl, Klaus Hammer, Markus Witte] DE Regensburg An electronic component is described and has a dielectric layer which is constructed on a substrate, conductive surfaces that are constructed on the dielectric layer, and an electrically conductive guard structure. The guard structure is disposed in a plane above the conductive surfaces such that the conductive surfaces are not completely covered by the guard structure.

[OPOLKA, Heinz, VON BASSE, Paul-Werner, SCHEITER, Thomas, GROSSMANN, Rainer, PETERS, Christian, FISCHBACH, Reinhard, GAYMANN, Andreas, ROSTECK, Thomas, SIPRAK, Domagoj, SASSE, Thorsten, GÖLLNER, Reinhard, BIERNER, Justin, MELZL, Michael, HAMMER, Klaus, WITTE, Markus] St.-Martin-Strasse 53, 81669 München, DE

[Heinz Opolka, Paul-Werner Von Basse, Thomas Scheiter, Rainer Grossmann, Christian Peters, Reinhard Fischbach, Andreas Gaymann, Thomas Rosteck, Domagoj Siprak, Thorsten Sasse, Reinhard Göllner, Justin Bierner, Michael Melzl, Klaus Hammer, Markus Witte] DE Munich An electronic component is described and has a dielectric layer which is constructed on a substrate, conductive surfaces that are constructed on the dielectric layer, and an electrically conductive guard structure. The guard structure is disposed in a plane above the conductive surfaces such that the conductive surfaces are not completely covered by the guard structure.

[OPOLKA, Heinz, VON BASSE, Paul-Werner, SCHEITER, Thomas, GROSSMANN, Rainer, PETERS, Christian, FISCHBACH, Reinhard, GAYMANN, Andreas, ROSTECK, Thomas, SIPRAK, Domagoj, SASSE, Thorsten, GÖLLNER, Reinhard, BIERNER, Justin, MELZL, Michael, HAMMER, Klaus, WITTE, Markus] St.-Martin-Strasse 53, 81669 München, DE

[OPOLKA HEINZ, VON BASSE PAUL-WERNER, SCHEITER THOMAS, GROSSMANN RAINER, PETERS CHRISTIAN, FISCHBACH REINHARD, GAYMANN ANDREAS, ROSTECK THOMAS, SIPRAK DOMAGOJ, SASSE THORSTEN, GOELLNER REINHARD, BIERNER JUSTIN, MELZL MICHAEL, HAMMER KLAUS, WITTE MARKUS] DE

[OPOLKA HEINZ, VON BASSE PAUL-WERNER, SCHEITER THOMAS, GROSSMANN RAINER, PETERS CHRISTIAN, FISCHBACH REINHARD, GAYMANN ANDREAS, ROSTECK THOMAS, SIPRAK DOMAGOJ, SASSE THORSTEN, GOELLNER REINHARD, BIERNER JUSTIN, MELZL MICHAEL, HAMMER KLAUS, WITTE MARKUS] DE

[OPOLKA, Heinz, VON BASSE, Paul-Werner, SCHEITER, Thomas, GROSSMANN, Rainer, PETERS, Christian, FISCHBACH, Reinhard, GAYMANN, Andreas, ROSTECK, Thomas, SIPRAK, Domagoj, SASSE, Thorsten, GÖLLNER, Reinhard, BIERNER, Justin, MELZL, Michael, HAMMER, Klaus, WITTE, Markus] St.-Martin-Str. 53 D-81541 München;Ilzstrasse 1a D-93509 Regensburg;Heiglstr. 60 D-82515 Wolfratshausen;Flösserweg 13 D-82041 Oberhaching;Gustav-Heinemann-Ring 31 D-81739 München;Weissenburger Platz 1 D-81667 München;Bössnerstr. 27 D-93049 Regensburg;Edelweisstr. 8 D-81541 München;Bergham 8b D-83624 Otterfing;Bössnerstr. 23 D-93051 Regensburg;Wittweg 8 D-93049 Regensburg;Fährinweg 7 D-93049 Regensburg;Schönbrunner Str. 6 D-92242 Hirschau;Laberstr. 8 D-93073 Neutraubling;Ringstr. 6 D-93149 Nittenau/Fischbach;Ziegetsdorfer Str. 118 D-93051 Regensburg The invention relates to an electronic component, comprising a dielectric layer (2) which is configured on a substrate (10), conductive surfaces (4; 14) which are configured on said dielectric layer and an electroconductive protective structure (6) which is arranged in a plane above the conductive surfaces (6) in such a way that the conductive surfaces (4; 14) are not (entirely) covered by the protective structure (6).

[OPOLKA HEINZ, VON BASSE PAUL-WERNER, SCHEITER THOMAS, GROSSMANN RAINER, PETERS CHRISTIAN, FISCHBACH REINHARD, GAYMANN ANDREAS, ROSTECK THOMAS, SIPRAK DOMAGOJ, SASSE THORSTEN, GOELLNER REINHARD, BIERNER JUSTIN, MELZL MICHAEL, HAMMER KLAUS, WITTE MARKUS] DE

[FISCHBACH REINHARD] DE This invention concerns a contactless chip card containing besides a chip module (2) an induction coil (3) for data transmission. A lead frame (1) serves as the electrical connection for these two components. In contrast to solutions in prior art, the contact between the lead frame (1) and induction coil (3) is much simpler. In the area of the coil pads (7), apertures (5) are made through the coil pads (7) and substrate film (8) through which the lead frame contacts (4) pass and are soldered on the upper surface.