[Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Hsiu-Jen Lin, Bor-Ping Jang, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu, Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Kuei-Wei Huang, Wei-Hung Lin] TW Xinfeng Township Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.

[Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chih-Wei Lin, Wen-Hsiung Lu, Hsiu-Jen Lin, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu] TW Changzhi Township A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.

[Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng, Ching-Shi Liu] TW Hsin-Chu Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.

[Wen-Hsiung Lu, Ming-Da Cheng, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin, Chung-Shi Liu] TW Jhonghe Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.

[Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu] TW Xinfeng Township Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.

[Hsiang-Lin Lin, Ching-Huan Lin, Chih-Hung Shih, Wei-Ming Huang, Chih-Hung Lin, Yu-Cheng Chen, Yi-Hui Li, Tsan-Chun Wang] TW Hsinchu This invention in one aspect relates to a pixel structure. In one embodiment, the pixel structure includes a scan line formed on a substrate and a data line formed over the substrate defining a pixel area, a switch formed inside the pixel area on the substrate, a shielding electrode formed over the switch, a plane organic layer formed over the date line and the pixel area and having no overlapping with the shielding electrode, and a pixel electrode having a first portion and a second portion extending from the first portion, and formed over the shielding electrode and the plane organic layer in the pixel area, wherein the first portion is overlapped with the shielding electrode so as to define a storage capacitor therebetween, and the second portion overlays the plane organic layer and has no overlapping with the data line.

[Pei-Ling Fang, Chien-Hung Lin, Meng-Ching Lin, Hsin-Yu Li, Yu-Nan Wei, Hung-Jen Syu, Pin-Hsiao Lin, Ching-Yang Li] TW Changhua County The reservation and notification system contains a ticketing device at a consumer site and a mobile communication device carried by a customer for interaction with the ticketing device. The ticketing device radiates signals and the mobile communication device, when the customer enters the consumer site, senses and receives signals from the ticketing device. A processing device allows the customer to make a reservation at a specific time calculated by the processing device according to the number of customers waiting. Once the customer confirm the reservation, the processing device issues an electronic ticket. The processing device then notifies the customer some time before the reservation period to return to the consumer site. After validating the electronic ticket, the customer is allowed to access the consumer site, thereby saving the time waiting in line.

[Shen-Hua Peng, Hsin-Hsin Shen, Liang-Yo Yang, Meng-Yow Hsieh, Pei-Shan Li, Wei-Lin Yu, Tsai-Yu Lin, Po-Liang Lai, Jui-Sheng Sun, Chih-Hung Chang, Yi-Hung Lin] TW Taoyuan County Thermal responsive compositions for treating bone diseases are provided. The thermal responsive composition for treating bone diseases includes a bone growth factor and a biodegradable copolymer. The biodegradable copolymer has a structure of Formula (I) or Formula (II):A-B-BOX-B-A  Formula (I)B-A-B-(BOX-B-A-B)n-BOX-B-A-B  Formula (II)wherein, A includes a hydrophilic polyethylene glycol polymer, B includes a hydrophobic polyester polymer, BOX is a bifunctional group monomer of 2, 2′-Bis(2-oxazoline) and used for coupling the blocks A-B or B-A-B, and n is an integer and the same or more than 0.

[Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chih Chun Chiu, Ming-Da Cheng, Chung-Shi Liu] TW Changzhi Township A system and method for forming contacts is provided. An embodiment comprises forming the contacts on a substrate and then coining the contacts by physically shaping them using, e.g., a molding chamber. The physical shaping of the contacts may be performed using a patterned portion of the molding chamber or else by placing a patterned stencil around the contacts prior before a force is applied to physically reshape the contacts. The contacts may be reshaped into a cylindrical, oval, cuboid, or rectangular shape, for example.

[Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng, Chung-Shi Liu] TW Changzhi Township A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer.