[LEE, Won Hyo 이원효, KIM, Jong Sun 김종선, YOON, Byoung Jin 윤병진] 302ho, 163, Nonhyeon-ro 06740 서울시 서초구 논현로 163 302호, SeoulSeocho-GuSeoul 06740 The present invention relates to an offset cancelling circuit of a current balancing circuit, and the purpose of the present invention is to solve a current imbalance due to an offset caused by mismatches, process, voltage, temperature (PVT) variations and the like of an element. More particularly, a current balancing circuit according to the present invention comprises: a first comparator unit having a first offset voltage formed between two inputs thereof, and having an offset cancellation voltage that is input into any one of the inputs; a second comparator unit having a second offset voltage formed between two inputs thereof, having an output voltage of the first comparator unit that is input into any one of the inputs, and having a reference voltage that is input into the other of the inputs; a third comparator unit having a third offset voltage formed between two inputs thereof, having an output voltage of the second comparator unit that is input into any one of the inputs, and having a reference voltage that is input into the other of the inputs; and a control unit for forming and outputting the offset cancellation voltage, which increases along time during calibration, and outputting the offset cancellation voltage if the offset cancellation voltage is greater than a sum of the first offset voltage, the second offset voltage and the third offset voltage. The present invention relates to an offset cancelling circuit of a current balancing circuit, and the purpose of the present invention is to solve a current imbalance due to an offset caused by mismatches, process, voltage, temperature (PVT) variations and the like of an element. More particularly, a current balancing circuit according to the present invention comprises: a first comparator unit having a first offset voltage formed between two inputs thereof, and having an offset cancellation voltage that is input into any one of the inputs; a second comparator unit having a second offset voltage formed between two inputs thereof, having an output voltage of the first comparator unit that is input into any one o

[KIM, Jong Sun 김종선, LEE, Yong Woon 이용운, YOON, Byoung Jin 윤병진] 302ho, 163, Nonhyeon-ro 06740 서울시 서초구 논현로 163 302호, SeoulSeocho-GuSeoul 06740 An LED backlight unit according to the present technique comprises: a light emitting element; a data control unit that receives an input of a control signal in which emission data, a clock signal, and an activation signal are embedded at different levels, and outputs a brightness control signal for controlling brightness and an emission time control signal for controlling an emission time; an emission control unit that receives inputs of the brightness control signal and the emission time control signal and drives the light emitting element to emit light with the brightness corresponding to the brightness control signal during the emission time corresponding to the emission time control signal; and a failure detection unit that detects a voltage at a node to which the emission control unit and the light emitting element are connected, and outputs a failure signal corresponding to whether or not a failure has occurred in the light emitting element, wherein the data control unit outputs the failure detected by the failure detection unit as a failure detection signal. An LED backlight unit according to the present technique comprises: a light emitting element; a data control unit that receives an input of a control signal in which emission data, a clock signal, and an activation signal are embedded at different levels, and outputs a brightness control signal for controlling brightness and an emission time control signal for controlling an emission time; an emission control unit that receives inputs of the brightness control signal and the emission time control signal and drives the light emitting element to emit light with the brightness corresponding to the brightness control signal during the emission time corresponding to the emission time control signal; and a failure detection unit that detects a voltage at a node to which the emission control unit and the light emitting element are connected, and outputs a failure signal corresponding to whether or not a failure has occurred in the light emitting element, wherein the data control unit outputs the failure detected by the failure detection unit as a failure detection signal.

[KIM, Jong Sun 김종선, KIM, Jin Hyuk 김진혁] 302ho 06740 서울시 서초구 논현로 163 302호, Seoul163, Nonhyeon-roSeocho-guSeoul 06740 The present invention relates to a display including an LED active matrix and, more specifically, to an LED pixel package which allows the implementation of an LED active matrix display while reducing the number of required pins, by comprising: a signal control unit for controlling an output signal and a signal output according to a signal input level; a light emission control unit for controlling an LED light emission signal by using the output signal and signal output; and a pixel unit for controlling the magnitude and timing of current flowing through each LED, on the basis of the LED light emission signal. The present invention relates to a display including an LED active matrix and, more specifically, to an LED pixel package which allows the implementation of an LED active matrix display while reducing the number of required pins, by comprising: a signal control unit for controlling an output signal and a signal output according to a signal input level; a light emission control unit for controlling an LED light emission signal by using the output signal and signal output; and a pixel unit for controlling the magnitude and timing of current flowing through each LED, on the basis of the LED light emission signal.

[KIM, Jin Hyuk 김진혁, KIM, Jong Sun 김종선] 302ho, 163, Nonhyeon-ro 06740 서울시 서초구 논현로 163, 302호, SeoulSeocho-guSeoul 06740 A device according to the present technology comprises: ports for inputting and outputting of a chip selection signal, inputting and outputting of a serial clock, and inputting and outputting of serial data, respectively; a register; a plurality of slaves connected to each other in cascades; and a host for forming and outputting the chip selection signal, forming and outputting the serial clock, and forming and outputting the serial data, wherein the serial data includes an assignment byte for controlling a slave, an address byte of the register included in the slave, and a data byte to be stored in the register. A device according to the present technology comprises: ports for inputting and outputting of a chip selection signal, inputting and outputting of a serial clock, and inputting and outputting of serial data, respectively; a register; a plurality of slaves connected to each other in cascades; and a host for forming and outputting the chip selection signal, forming and outputting the serial clock, and forming and outputting the serial data, wherein the serial data includes an assignment byte for controlling a slave, an address byte of the register included in the slave, and a data byte to be stored in the register.

[KIM, Jin Hyuk 김진혁, KIM, Jong Sun 김종선] 302ho, 163, Nonhyeon-ro 06740 서울시 서초구 논현로 163, 302호, SeoulSeocho-guSeoul 06740 A multi-pixel package according to the present embodiment comprises: a plurality of pixel groups comprising a plurality of each of unit pixels including Red (R), Green (G), and Blue (B) LEDs to which a cathode is commonly connected; and a control circuit for receiving a control signal having a pulse train embedded therein comprising a data signal for controlling luminance of light output by the unit pixels belonging to a pixel group, an activation signal, and a plurality of pulses, wherein the control circuit comprises: a signal separation unit for separating and respectively outputting the activation signal and the pulse train; a charging signal activated by means of the activation signal, and controlling such that each pixel group charges energy for emitting light from the pulse train; a light emission control unit for outputting an emission signal for controlling such that each pixel group emits light from the pulse train; and a pixel group control unit which charges energy provided to the data signal as the charging signal is provided, and controls such that the pixel groups emit light by the emission signal. A multi-pixel package according to the present embodiment comprises: a plurality of pixel groups comprising a plurality of each of unit pixels including Red (R), Green (G), and Blue (B) LEDs to which a cathode is commonly connected; and a control circuit for receiving a control signal having a pulse train embedded therein comprising a data signal for controlling luminance of light output by the unit pixels belonging to a pixel group, an activation signal, and a plurality of pulses, wherein the control circuit comprises: a signal separation unit for separating and respectively outputting the activation signal and the pulse train; a charging signal activated by means of the activation signal, and controlling such that each pixel group charges energy for emitting light from the pulse train; a light emission control unit for outputting an emission signal for controlling such that each pixel group emits light from the pulse train; and a pixel group control unit which charges energy provided to the data signal as the charging signal is provided, and controls such that the pixel groups emit light by the emission signal.

[AHN, Hyun Joon 안현준, CHOI, Min Kyoung 최민경, LEE, Je Cheol 이제철, LEE, Jeong Woo 이정우, KIM, Jong Sun 김종선, HWANG, Jong Beon 황종범, YOON, Byoung Jin 윤병진] 302ho, 163, Nonhyeon-ro 06740 서울시 서초구 논현로 163 302호, SeoulSeocho-GuSeoul 06740 A pressure sensor according to the present invention comprises: a clip part having a first surface and a second surface bent to face each other such that the distance between the first surface and the second surface changes as pressure is provided; a flexible substrate which is disposed on the first surface, and on which a coil forming a magnetic field with a provided electrical signal is located; and a circuit part for providing the coil with the electrical signal and detecting a change in inductance of the coil when the distance between the first surface and the second surface changes.

[KIM, Jin Hyuk 김진혁, KIM, Jong Sun 김종선] 302ho, 163, Nonhyeon-ro 06740 서울시 서초구 논현로 163 302호, SeoulSeocho-GuSeoul 06740 The present invention relates to a method for controlling a μLED pixel structure and, more specifically, to a method for controlling a μLED pixel structure, the method allowing to further facilitate control of a greyscale of the μLED by completely removing interference of a driving PMOS threshold voltage in determining a magnitude of a current flowing to the μLED. The present invention relates to a method for controlling a μLED pixel structure and, more specifically, to a method for controlling a μLED pixel structure, the method allowing to further facilitate control of a greyscale of the μLED by completely removing interference of a driving PMOS threshold voltage in determining a magnitude of a current flowing to the μLED.

[KIM, Jong Sun 김종선, KIM, Jin Hyuk 김진혁] 302ho 06740 서울시 서초구 논현로 163 302호, Seoul163, Nonhyeon-roSeocho-guSeoul 06740 The present invention relates to a force sensor module and, more specifically, to a mutual inductive force sensor module for implementing a three-dimensional touch, the module detecting a degree of applied force by using inductance varying according to the change in distance between coils formed on each two-layer FPCB, thereby implementing a three-dimensional touch of a display panel. The present invention relates to a force sensor module and, more specifically, to a mutual inductive force sensor module for implementing a three-dimensional touch, the module detecting a degree of applied force by using inductance varying according to the change in distance between coils formed on each two-layer FPCB, thereby implementing a three-dimensional touch of a display panel.

[KIM, Jin Hyuk 김진혁, KIM, Jong Sun 김종선] 302ho, 163, Nonhyeon-ro 06740 서울시 서초구 논현로 163, 302호, SeoulSeocho-guSeoul 06740 The present invention relates to: an LED pixel package comprising an active pixel IC, the LED pixel package having excellent display contrast and excellent black display; and a manufacturing method therefor. More particularly, the present invention provides a method for manufacturing an LED pixel package comprising an active pixel IC, the method comprising the steps of: (a) flip chip bonding, on a substrate, at least one LED chip and at least one active pixel IC; (b) molding the upper part of the substrate with a black resin so as to cover the entire LED chip and active pixel IC; (c) grinding the upper part of a region molded with the black resin so that the upper surface of the LED chip is exposed; and (d) cutting the LED chip and the active pixel IC so as to form a pair of each.

[KIM, Jong Sun 김종선, KIM, Jin Hyuk 김진혁] 302ho 06740 서울시 서초구 논현로 163 302호, Seoul163, Nonhyeon-roSeocho-guSeoul 06740 The present invention relates to a force sensor module and, more specifically, to a self-inductive force sensor module for realizing a 3D touch that, by using an inductance varying depending on a distance change between a sensing target and a coil, senses a degree of applied force and realizes a 3D touch of a display panel by using the same. More specifically describing the present invention, the present invention provides a self-inductive force sensor module for realizing a 3D touch, comprising: a sensing target; a two-layer flexible printed circuit board (FPCB) that is located below the sensing target and consists of an upper layer FPCB and a lower layer FPCB which are in contact with one side of each other, at least one coil being formed on the other side of each of the upper layer FPCB and lower layer FPCB; and a supporter disposed between the sensing target and the 2-layer FPCB so that the sensing target and the 2-layer FPCB may be spaced apart from each other, wherein an inductance varies depending on a distance between the sensing target and the coil, which varies according to the force applied to the sensing target. The present invention relates to a force sensor module and, more specifically, to a self-inductive force sensor module for realizing a 3D touch that, by using an inductance varying depending on a distance change between a sensing target and a coil, senses a degree of applied force and realizes a 3D touch of a display panel by using the same. More specifically describing the present invention, the present invention provides a self-inductive force sensor module for realizing a 3D touch, comprising: a sensing target; a two-layer flexible printed circuit board (FPCB) that is located below the sensing target and consists of an upper layer FPCB and a lower layer FPCB which are in contact with one side of each other, at least one coil being formed on the other side of each of the upper layer FPCB and lower layer FPCB; and a supporter disposed between the sensing target and the 2-layer FPCB so that the sensing target and the 2-layer FPCB may be spaced apart from each other, wherein an inductance varies depending on a distance between the sensing target and the coil, which varies according to the force applied to the sensing target.